United States - TECHNOLOGY TRANSFER OPPORTUNITY: SiC-Based Microstructures for Sensors (LEW-TOPS-128)
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Details
Provided by
- Opportunity closing date
- 03 July 2020
- Opportunity publication date
- 10 July 2019
- Value of contract
- to be confirmed
- Your guide to exporting
Description
Added: Jul 09, 2019 11:02 am
NASA's Technology Transfer Program solicits inquiries from companies interested in obtaining license rights to commercialize, manufacture and market the following technology. License rights may be issued on an exclusive or nonexclusive basis and may include specific fields of use. NASA provides no funding in conjunction with these potential licenses.
THE TECHNOLOGY:
Innovators at NASA's Glenn Research Center have developed ultra-thin silicon carbide (SiC) microstructures that enable highly sensitive pressure sensors that are bio-compatible. The novel method of fabricating these microstructures, Dopant Selective Reactive Ion Etching (DSRIE), allows for structures as thin as 2 microns to be achieved, while allowing multifunctional sensors to be fabricated on a single SiC wafer. For the first time, it is possible to batch-fabricate ultra-thin SiC diaphragms that can sense very low pressures, enabling pressure sensors that can measure sub-psi pressures. This faster process makes it easier and less costly to produce complex, advanced semiconductors that are fully functional at temperatures greater than 600°C. This technique enables a new generation of SiC-based microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) such as accelerometers, pressure sensors, and biosensors.
To express interest in this opportunity, please submit a license application through NASA's Automated Technology Licensing Application System (ATLAS) by visiting https://technology.nasa.gov/patent/LEW-TOPS-128
If you have any questions, please contact NASA Glenn's Technology Transfer Office at grc-techtransfer@mail.nasa.gov with the title of this Technology Transfer Opportunity as listed in this FBO notice and your preferred contact information. For more information about licensing other NASA-developed technologies, please visit the NASA Technology Transfer Portal at https://technology.nasa.gov/
These responses are provided to members of NASA's Technology Transfer Program for the purpose of promoting public awareness of NASA-developed technology products, and conducting preliminary market research to determine public interest in and potential for future licensing opportunities. No follow-on procurement is expected to result from responses to this Notice.
- Opportunity closing date
- 03 July 2020
- Value of contract
- to be confirmed
About the buyer
- Address
- National Aeronautics and Space Administration HQ Code 210.H United States
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