France - Supply and installation of chemical-mechanical polishing equipment with integrated cleaning and drying modules
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Details
Provided by
- Opportunity closing date
- 23 September 2024
- Opportunity publication date
- 07 August 2024
- Value of contract
- to be confirmed
- Your guide to exporting
Description
CEA-Leti is looking to acquire chemical-mechanical polishing equipment with integrated cleaning and drying modules.
The equipment is aimed at applications without metallic contamination, for use at the start of the chip manufacturing chain. The materials concerned by this type of polishing are silicon oxide, nitride and a new generation of materials.
The equipment will be installed in the CEA's clean room. It is designed to process 300mm wafers for the development of advanced 7nm FDSOI technologies and beyond.
- Opportunity closing date
- 23 September 2024
- Value of contract
- to be confirmed
About the buyer
- Address
- Autres organismes
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